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Thirteen Common Standards of SMT

Source: Linchuan Precision  Article author:Linchuan Precision  Time:2019-10-08 14:02  Read: 4464

Do you know the 13 standards commonly used in SMT?

1) IPC-ESD-2020: Joint standard for the development of electrostatic discharge control programs. Includes the design, establishment, implementation, and maintenance necessary for electrostatic discharge control procedures. Provide guidance on the handling and protection of electrostatic discharge sensitive periods based on the historical experience of certain military and commercial organizations.

2) IPC-SA-61A: Semi-aqueous cleaning manual after welding. Includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, processes, process control, and environmental and safety considerations.

3) IPC-AC-62A: Water cleaning manual after welding. Describe the cost of manufacturing residues, the type and nature of water-based detergents, the process of cleaning water, equipment and processes, quality control, environmental control and employee safety, and the determination and determination of cleanliness. SMT steel mesh

4) IPC-DRM -4 0E: Through Hole Solder Joint Evaluation Desktop Reference Manual. A detailed description of the components, the walls of the holes, and the coverage of the soldered surfaces, in addition to the standard requirements, in addition to computer-generated 3D graphics. Covers tin filling, contact angles, soldering, vertical filling, pad coverage, and numerous solder joint defects.

5) IPC-TA-722: Welding Technology Evaluation Manual. Includes 45 articles on all aspects of welding technology, including general welding, welding materials, hand soldering, batch soldering, wave soldering, reflow soldering, vapor phase soldering, and infrared soldering. Laser steel mesh

6) IPC-7525: Template Design Guide. Provides guidelines for the design and manufacture of solder paste and surface mount adhesive coated stencils. i also discusses stencil design using surface mount technology and introduces kiln with via or flip chip components. Technology, including overprinting, double printing and staged template design.

7) IPC/EIA J-STD-004: Specification requirements for flux 1 include Appendix I. Contains technical specifications and classifications of rosin, resin, etc., organic and inorganic fluxes classified according to the content and degree of activation of halides in the flux; also includes the use of flux, substances containing flux, and low use in no-clean processes Residual flux.

8) IPC/EIA J-STD-005: Specification requirements for solder paste include Appendix I. The characteristics and technical requirements of the solder paste are listed, as well as the test method and metal content standards, as well as the viscosity, collapse, solder balls, tack and solder paste soldering properties. PCB steel mesh

9) IPC/EIA J-STD -0 06A: Specification requirements for electronic grade solder alloys, fluxes and non-flux solid solders. It is an electronic grade solder alloy, which is a rod, ribbon, powder flux and non-flux solder. It is an application for electronic soldering. It provides terminology, specification requirements and test methods for special electronic grade solder.

10) IPC-Ca-821: General requirements for thermal conductive adhesives. This includes requirements and test methods for thermally conductive dielectrics that bond components to a suitable location.

11) IPC-3406: Guide to Applying Adhesives to Conductive Surfaces. Provides guidance in the selection of conductive adhesives as soldering alternatives in electronics manufacturing.

12) IPC-AJ-820: Assembly and Welding Manual. Contains descriptions of inspection techniques for assembly and soldering, including terminology and definitions; printed circuit boards, types of components and pins, materials for solder joints, component mounting, specification references and outlines for design; soldering techniques and packaging; Cleaning and laminating; quality assurance and testing.

13) IPC-7530: Guidelines for temperature profiles for batch soldering processes (reflow soldering and wave soldering). Various testing methods, techniques and methods are used in the acquisition of temperature profiles to provide guidance for building better graphics.

This is the 13 standards commonly used by SMT. Do you understand?

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